arXiv:2409.04310cs.CV2024-09ECCV被引 1

用新框架自动识别并分割半导体纳米缺陷,省去人工标注

Advancing SEM Based Nano-Scale Defect Analysis in Semiconductor Manufacturing for Advanced IC Nodes

  • 用可变形DETR+BoxSnake实现端到端缺陷检测与分割
  • 在真实晶圆数据集上检测与分割准确率分别达72.19%和78.86%
  • 无需像素级标注,适合先进制程缺陷分析

本研究提出一种统一的端到端自动化缺陷分类-检测-分割(ADCDS)框架,用于先进制程节点中多实例半导体缺陷的分类、检测与分割。该框架包含两个模块:(a)缺陷检测模块,采用可变形DETR进行缺陷分类与定位;(b)缺陷分割模块,使用BoxSnake实现基于框监督的实例分割。该设计免除了传统分割模型对人工像素级掩码标注的依赖。我们在来自真实晶圆的两个工艺数据集ADI和AEI上评估了该框架性能,重点关注线-空间结构。尤其在缺乏像素级标注的挑战性ADI SEM数据集上,验证了方法在纳米级缺陷分割及二值缺陷掩码生成中的有效性。与以往方法对比表明,本框架在ADI数据集上检测[email protected]达72.19%,分割达78.86%;在AEI数据集上分别为90.38%与95.48%,充分满足先进缺陷分析需求并克服关键限制。

原文摘要 · Abstract (English)

In this research, we introduce a unified end-to-end Automated Defect Classification-Detection-Segmentation (ADCDS) framework for classifying, detecting, and segmenting multiple instances of semiconductor defects for advanced nodes. This framework consists of two modules: (a) a defect detection module, followed by (b) a defect segmentation module. The defect detection module employs Deformable DETR to aid in the classification and detection of nano-scale defects, while the segmentation module utilizes BoxSnake. BoxSnake facilitates box-supervised instance segmentation of nano-scale defects, supported by the former module. This simplifies the process by eliminating the laborious requirement for ground-truth pixel-wise mask annotation by human experts, which is typically associated with training conventional segmentation models. We have evaluated the performance of our ADCDS framework using two distinct process datasets from real wafers, as ADI and AEI, specifically focusing on Line-space patterns. We have demonstrated the applicability and significance of our proposed methodology, particularly in the nano-scale segmentation and generation of binary defect masks, using the challenging ADI SEM dataset where ground-truth pixelwise segmentation annotations were unavailable. Furthermore, we have presented a comparative analysis of our proposed framework against previous approaches to demonstrate its effectiveness. Our proposed framework achieved an overall [email protected] of 72.19 for detection and 78.86 for segmentation on the ADI dataset. Similarly, for the AEI dataset, these metrics were 90.38 for detection and 95.48 for segmentation. Thus, our proposed framework effectively fulfils the requirements of advanced defect analysis while addressing significant constraints.

缺陷检测半导体图像分割AI质检

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