用实验数据建模预测宽禁带器件温升，省去物理参数细节
Deployment of ARX Models for Thermal Forecasting in Power Electronics Boards Using WBG Semiconductors
- 基于实验数据构建ARX参数化模型，无需材料厚度等物理信息
- 预测精度媲美有限元仿真，误差显著低于传统热模型
- 适合工程部署，特别适用于快速热管理方案设计
面对宽禁带（WBG）半导体的热管理挑战，本研究强调使用ARX参数化模型进行温度预测，该方法无需了解组件厚度差异或材料物理特性，仅依赖实验测量数据即可实现高精度预测。这类参数化模型成为有限元分析（FEM）和传统热模型的可靠替代方案，在大幅简化系统辨识的同时，仍能保证高精度结果。
原文摘要 · Abstract (English)
Facing the thermal management challenges of Wide Bandgap (WBG) semiconductors, this study highlights the use of ARX parametric models, which provide accurate temperature predictions without requiring detailed understanding of component thickness disparities or material physical properties, relying solely on experimental measurements. These parametric models emerge as a reliable alternative to FEM simulations and conventional thermal models, significantly simplifying system identification while ensuring high result accuracy.
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