用2.5D方法提升增材制造部件的X射线断层扫描分辨率,加速缺陷检测。
2.5D Super-Resolution Approaches for X-ray Computed Tomography-based Inspection of Additively Manufactured Parts
- 利用相邻切片信息增强中心切片分辨率,兼顾上下文与效率。
- 相比3D方法降低计算开销,比纯2D方法提升细节还原能力。
- 适合高通量增材制造零件无损检测,实用性强。
X射线计算机断层扫描(XCT)是增材制造(AM)零件非破坏性评估的关键工具,可实现内部结构检查与缺陷检测。尽管应用广泛,高分辨率CT扫描耗时极长。通过低分辨率扫描可缓解时间问题,但会牺牲空间细节,影响缺陷检测精度。超分辨率算法为克服XCT重建中的分辨率限制提供了可行方案,有助于更准确地识别缺陷。虽然2D超分辨率在自然图像上表现优异,但直接应用于XCT切片时效果不佳;而3D方法计算成本过高,难以用于大规模应用。为此,我们提出一种专为AM零件XCT设计的2.5D超分辨率方法。该方法通过利用邻近低分辨率切片的信息来提升中心切片的分辨率,在不引入全3D方法巨大计算开销的前提下,保留了切片间的空间上下文信息。该方法在2D与3D之间取得平衡,为增材制造零件的高通量缺陷检测提供实用解决方案。
原文摘要 · Abstract (English)
X-ray computed tomography (XCT) is a key tool in non-destructive evaluation of additively manufactured (AM) parts, allowing for internal inspection and defect detection. Despite its widespread use, obtaining high-resolution CT scans can be extremely time consuming. This issue can be mitigated by performing scans at lower resolutions; however, reducing the resolution compromises spatial detail, limiting the accuracy of defect detection. Super-resolution algorithms offer a promising solution for overcoming resolution limitations in XCT reconstructions of AM parts, enabling more accurate detection of defects. While 2D super-resolution methods have demonstrated state-of-the-art performance on natural images, they tend to under-perform when directly applied to XCT slices. On the other hand, 3D super-resolution methods are computationally expensive, making them infeasible for large-scale applications. To address these challenges, we propose a 2.5D super-resolution approach tailored for XCT of AM parts. Our method enhances the resolution of individual slices by leveraging multi-slice information from neighboring 2D slices without the significant computational overhead of full 3D methods. Specifically, we use neighboring low-resolution slices to super-resolve the center slice, exploiting inter-slice spatial context while maintaining computational efficiency. This approach bridges the gap between 2D and 3D methods, offering a practical solution for high-throughput defect detection in AM parts.
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