用光学显微镜实现硅/玻璃通孔三维检测，突破传统表面局限
Advanced 3D Imaging Approach to TSV/TGV Metrology and Inspection Using Only Optical Microscopy
- 融合多角度光照与显微成像，实现通孔内部结构3D重建
- 可识别微米级缺陷及边缘异常，精度显著优于传统方法
- 适合半导体制造中高性价比的通孔质量检测场景
本文提出一种创新的硅和玻璃通孔检测方法，结合混合场显微术与光度立体技术。传统光学显微镜仅能进行表面检测，难以观察硅和玻璃通孔内部结构。通过多种光照条件实现3D重建，该方法不仅提升了微米级缺陷检测能力，还实现了深度与边缘异常的精细可视化，这些特征在传统光学显微镜下通常不可见。实验结果表明，所提方法能有效捕捉复杂表面细节与内部结构。重建模型与实际测量的定量对比显示，该方法显著提升了硅和玻璃通孔检测的准确性和重复性。同时，在保持高精度的同时实现更高成本效益，标志着通孔检测技术的重要进展。
原文摘要 · Abstract (English)
This paper introduces an innovative approach to silicon and glass via inspection, which combines hybrid field microscopy with photometric stereo. Conventional optical microscopy techniques are generally limited to superficial inspections and struggle to effectively visualize the internal structures of silicon and glass vias. By utilizing various lighting conditions for 3D reconstruction, the proposed method surpasses these limitations. By integrating photometric stereo to the traditional optical microscopy, the proposed method not only enhances the capability to detect micro-scale defects but also provides a detailed visualization of depth and edge abnormality, which are typically not visible with conventional optical microscopy inspection. The experimental results demonstrated that the proposed method effectively captures intricate surface details and internal structures. Quantitative comparisons between the reconstructed models and actual measurements present the capability of the proposed method to significantly improve silicon and glass via inspection process. As a result, the proposed method achieves enhanced cost-effectiveness while maintaining high accuracy and repeatability, suggesting substantial advancements in silicon and glass via inspection techniques
Thank you to arXiv for use of its open access interoperability. PaperDance 不是 arXiv 官方产品；中文卡片由大模型生成，请以原文为准。