用AI全自动设计处理器芯片,解决硬件软件协同难题。
QiMeng: Fully Automated Hardware and Software Design for Processor Chip
- 构建专用大模型理解芯片设计知识
- 自动完成硬件与软件协同设计
- 适合芯片研发自动化团队使用
处理器芯片设计是推动计算机科学突破的关键前沿。随着信息技术快速发展,传统设计范式面临三大挑战:制造技术的物理限制、设计资源需求激增、生态系统日益多样化。自动化芯片设计成为突破瓶颈的变革性方案。尽管人工智能,尤其是大语言模型(LLMs)的发展为全自动芯片设计带来新可能,但针对芯片领域的专用大模型仍面临诸多挑战。本文提出QiMeng系统,实现处理器芯片的软硬件全自动化设计。该系统包含三层架构:底层构建领域专用的大芯片模型(LPCM),在架构、训练和推理层面创新,解决知识表示鸿沟、数据稀缺、正确性保障及庞大解空间等问题;中层利用LPCM的知识表示与推理能力,开发硬件设计代理与软件设计代理,实现芯片软硬件的自动化生成;目前部分组件已实现并应用于多个上层应用,展现出显著优势,为高效全自动芯片设计提供了可行路径。未来将整合所有模块,开展自顶向下与自底向上的迭代设计,建立完整的QiMeng系统。
原文摘要 · Abstract (English)
Processor chip design technology serves as a key frontier driving breakthroughs in computer science and related fields. With the rapid advancement of information technology, conventional design paradigms face three major challenges: the physical constraints of fabrication technologies, the escalating demands for design resources, and the increasing diversity of ecosystems. Automated processor chip design has emerged as a transformative solution to address these challenges. While recent breakthroughs in Artificial Intelligence (AI), particularly Large Language Models (LLMs) techniques, have opened new possibilities for fully automated processor chip design, substantial challenges remain in establishing domain-specific LLMs for processor chip design. In this paper, we propose QiMeng, a novel system for fully automated hardware and software design of processor chips. QiMeng comprises three hierarchical layers. In the bottom-layer, we construct a domain-specific Large Processor Chip Model (LPCM) that introduces novel designs in architecture, training, and inference, to address key challenges such as knowledge representation gap, data scarcity, correctness assurance, and enormous solution space. In the middle-layer, leveraging the LPCM's knowledge representation and inference capabilities, we develop the Hardware Design Agent and the Software Design Agent to automate the design of hardware and software for processor chips. Currently, several components of QiMeng have been completed and successfully applied in various top-layer applications, demonstrating significant advantages and providing a feasible solution for efficient, fully automated hardware/software design of processor chips. Future research will focus on integrating all components and performing iterative top-down and bottom-up design processes to establish a comprehensive QiMeng system.
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