用扩散模型根据加工参数生成高保真微观结构图像
Parameter-aware high-fidelity microstructure generation using stable diffusion
- 将加工参数嵌入扩散模型,实现条件生成
- 合成图像与真实图像在统计上高度一致,误差低于2.1%
- 适合材料设计与数据稀缺场景的高效生成
基于加工参数生成真实感微观结构图像对理解材料设计中的工艺-结构关系至关重要。然而,受限于训练图像数量和加工变量的连续性,该任务仍具挑战。本文提出一种基于Stable Diffusion 3.5 Large(SD3.5-Large)的新型过程感知生成方法。通过引入数值感知嵌入,将退火温度、时间及放大倍数等连续变量直接编码至模型条件中,实现特定工艺条件下可控生成,并捕捉工艺驱动的微结构变化。为应对数据稀缺与计算成本,采用DreamBooth与低秩适配(LoRA)仅微调少量参数,高效迁移预训练模型至材料领域。使用基于微调U-Net与VGG16编码器的语义分割模型验证真实性,在24张标注图像上达到97.1%准确率与85.7%平均交并比,优于先前方法。定量分析显示合成与真实微结构在物理描述符与空间统计上高度一致:两点相关性和线性路径误差分别低于2.1%与0.6%。本方法是首个适配SD3.5-Large用于过程感知微结构生成的工作,为数据驱动材料设计提供可扩展方案。
原文摘要 · Abstract (English)
Synthesizing realistic microstructure images conditioned on processing parameters is crucial for understanding process-structure relationships in materials design. However, this task remains challenging due to limited training micrographs and the continuous nature of processing variables. To overcome these challenges, we present a novel process-aware generative modeling approach based on Stable Diffusion 3.5 Large (SD3.5-Large), a state-of-the-art text-to-image diffusion model adapted for microstructure generation. Our method introduces numeric-aware embeddings that encode continuous variables (annealing temperature, time, and magnification) directly into the model's conditioning, enabling controlled image generation under specified process conditions and capturing process-driven microstructural variations. To address data scarcity and computational constraints, we fine-tune only a small fraction of the model's weights via DreamBooth and Low-Rank Adaptation (LoRA), efficiently transferring the pre-trained model to the materials domain. We validate realism using a semantic segmentation model based on a fine-tuned U-Net with a VGG16 encoder on 24 labeled micrographs. It achieves 97.1% accuracy and 85.7% mean IoU, outperforming previous methods. Quantitative analyses using physical descriptors and spatial statistics show strong agreement between synthetic and real microstructures. Specifically, two-point correlation and lineal-path errors remain below 2.1% and 0.6%, respectively. Our method represents the first adaptation of SD3.5-Large for process-aware microstructure generation, offering a scalable approach for data-driven materials design.
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