CHIME用异构存算芯片组,让边缘设备高效运行多模态大模型。
CHIME: Chiplet-based Heterogeneous Near-Memory Acceleration for Edge Multimodal LLM Inference
- 融合DRAM与RRAM芯片组,近数据计算减少通信开销。
- 在0.6B至3B模型上实现最高54倍加速和246倍能效提升。
- 适合资源受限的边缘端多模态大模型部署场景。
大规模语言模型(LLMs)的普及推动多模态助手在边缘设备的应用,但推理面临严苛的延迟与功耗限制,尤其在连接不稳定时更为突出。多模态大模型(MLLMs)将高维视觉输入转为长序列令牌,显著增大键值(KV)缓存,带来巨大数据移动开销。为此,本文提出CHIME,一种基于芯片组的异构近内存加速架构。CHIME利用集成式3D(M3D)DRAM与RRAM芯片组的互补优势:DRAM提供低延迟带宽用于注意力计算,RRAM则实现权重的高密度非易失存储。通过协同设计的映射框架,在数据附近执行融合核函数,最大限度减少跨芯片组通信,提升有效带宽。在FastVLM(0.6B/1.7B)和MobileVLM(1.7B/3B)上,CHIME相比边缘GPU NVIDIA Jetson Orin NX实现最高54倍加速与246倍能效提升,每焦耳支持116.5–266.5个令牌,远超Jetson的0.7–1.1。相较于现有先进存内计算(PIM)加速器FACIL,吞吐量提升达69.2倍。相比仅使用M3D DRAM的设计,异构内存使能效提升7%,性能提升2.4倍。
原文摘要 · Abstract (English)
The proliferation of large language models (LLMs) is accelerating the integration of multimodal assistants into edge devices, where inference is executed under stringent latency and energy constraints, often exacerbated by intermittent connectivity. These challenges become particularly acute in the context of multimodal LLMs (MLLMs), as high-dimensional visual inputs are transformed into extensive token sequences, thereby inflating the key-value (KV) cache and imposing substantial data movement overheads to the LLM backbone. To address these issues, we present CHIME, a chiplet-based heterogeneous near-memory acceleration for edge MLLMs inference. CHIME leverages the complementary strengths of integrated monolithic 3D (M3D) DRAM and RRAM chiplets: DRAM supplies low-latency bandwidth for attention, while RRAM offers dense, non-volatile storage for weights. This heterogeneous hardware is orchestrated by a co-designed mapping framework that executes fused kernels near data, minimizing cross-chiplet traffic to maximize effective bandwidth. On FastVLM (0.6B/1.7B) and MobileVLM (1.7B/3B), CHIME achieves up to 54x speedup and up to 246x better energy efficiency per inference as compared to the edge GPU NVIDIA Jetson Orin NX. It sustains 116.5-266.5 token/J compared to Jetson's 0.7-1.1 token/J. Furthermore, it delivers up to 69.2x higher throughput than the state-of-the-art PIM accelerator FACIL. Compared to the M3D DRAM-only design, CHIME's heterogeneous memory further improves energy efficiency by 7% and performance by 2.4x.
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