通过结构引导的掩码预训练和空间连续性正则化,提升微小缺陷检测精度。
Structure-Guided Mixed Masked Pretraining and Spatial Continuity Regularization for Printed Circuit Board Defect Detection

- 用结构引导的混合掩码设计,让模型从无标签图像中学习电路结构先验
- 在DspCBSD+数据集上达到85.5% mAP0.5,优于多个强基线模型
- 适合工业自动化检测场景,尤其对细长、低对比度缺陷有显著提升
印刷电路板(PCB)缺陷检测是自动化光学检测(AOI)的关键环节,但实际应用中仍具挑战性,因多数缺陷微小、对比度低且嵌入密集电路背景。本文提出一种两阶段PCB缺陷检测框架,结合结构引导的混合掩码预训练与空间连续性正则化。预训练阶段设计稀疏卷积掩码预训练方案,利用结构引导的混合掩码构建有信息量的遮蔽输入;稀疏卷积重建流程抑制遮蔽区域的无效响应,使检测主干网络能从可见导电图案推断缺失的电路结构,从而学习到PCB结构先验。微调阶段将预训练主干迁移至下游缺陷检测任务,并引入空间连续性正则项,约束同一缺陷实例的分散正向预测,促进对细长缺陷区域更紧凑的定位。在DspCBSD+数据集上的实验表明,该方法取得85.5% mAP0.5和52.3% mAP0.5:0.95,超越多个强基线检测器。消融实验与定性结果进一步验证了该框架在工业AOI场景中鲁棒检测的能力。
原文摘要 · Abstract (English)
Printed circuit board (PCB) defect detection is an essential part of automated optical inspection (AOI); yet it remains challenging in practice because many defects are tiny, low-contrast, and embedded in dense circuit backgrounds. To address these issues, this paper presents a two-phase PCB defect detection framework that combines structure-guided mixed masked pretraining with spatial continuity regularization. In the pretraining stage, we design a sparse convolutional masked pretraining scheme to exploit unlabeled PCB images, where structure-guided mixed masking is used to construct informative masked inputs. The sparse convolutional reconstruction pipeline suppresses invalid responses from masked regions and enables the detector backbone to infer missing PCB structures from visible conductive patterns, thereby learning PCB structural priors. In the fine-tuning stage, the pretrained backbone is transferred to the downstream defect detection task. For the task, a spatial continuity regularization term is introduced during fine-tuning. This term constrains dispersed positive predictions assigned to the same defect instance and promotes more compact localization on elongated defect regions. Experiments on the DsPCBSD+ dataset show that the proposed method achieves 85.5% mAP0.5 and 52.3% mAP0.5:0.95, outperforming several strong baseline detectors. Ablation studies and qualitative results further confirm the effectiveness of the proposed framework for robust PCB defect detection in industrial AOI scenarios.
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