在硅光芯片中嵌入二维光子晶体，实现低成本防伪认证。
Enhancing Co-packaging Optics Enabled Silicon Photonics Security Assurance Hardware Fingerprinting
- 利用光子晶体结构生成唯一光学指纹，基于波长、偏振和入射角
- 通过仿真优化纳米结构，实现亚50纳米精度的窄带反射峰值
- 无需额外工艺，适合大规模生产，适用于供应链安全验证
硅光子技术通过标准半导体工艺集成光学元件，显著提升数据通信带宽与能效。然而，光子集成电路（PIC）面临仿冒与篡改等独特安全威胁，传统电子安全手段难以应对。本文提出一种新型硬件指纹技术，在PIC的密度控制填充区嵌入二维光子晶体图案。每个光子晶体设计用于共振特定可见至近红外波段，生成基于波长、偏振与入射角的独特光学特征。采用ANSYS Lumerical的时域有限差分（FDTD）仿真优化纳米结构尺寸与间距，使各器件的反射/吸收谱呈现独特窄带峰。该方法仅需标准光刻工艺，无需额外步骤或材料，成本低。嵌入的纳米结构精度低于50纳米，极难伪造。本方法实现了高分辨率、可扩展的硅光芯片指纹，支持低成本设备认证与供应链安全增强。
原文摘要 · Abstract (English)
Silicon photonics enables integration of optical components using standard semiconductor processes, greatly improving data communication bandwidth and energy efficiency. However, photonics integrated circuits (PICs) face unique security challenges, such as counterfeit or tampering threats, that conventional electronic security methods do not address. We propose a novel hardware fingerprinting technique that embeds two dimensional photonic crystal patterns into the density control filler regions of a PIC. Each PhC pattern is designed to resonate a specific visible to near infrared wavelengths, producing a distinctive optical signature (based on wavelength, polarization, and incident angle) for each device. Finite difference time domain (FDTD) simulation using ANSYS Lumerical is employed to optimize nanostructure dimensions and spacing so that each device's reflection/absorption spectrum contains unique narrowband peaks. No extra fabrication steps or materials are required beyond standard lithography, keeping costs low. The embedded nanostructures have sub-50nm precision, making forgery extremely difficult. Our method yields a high resolution, scalable fingerprint for silicon photonic chips, enabling cost-effective device authentication and improved supply chain security.
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