首个面向PCB布局的多模态基准，评测大模型在约束下的几何推理能力。
OmniLayout: A Schematic-Coupled Multimodal Benchmark for Constraint-Aware Geometric Reasoning in PCB Layout
- 构建工业级电路图耦合的PCB布局数据集，含1681个真实设计
- 4项任务覆盖几何、布线、功能连通性及工具协同推理，共7.7万实例
- 揭示当前大模型在布线合理性与电路功能一致性上存在明显短板
近期大型语言模型（LLMs）在三维空间推理、空间定位和细粒度几何理解方面取得显著进展，但在严格的空间与功能约束下对密集对象布局的推理能力仍基本未被探索，而这是电子设计自动化（EDA）流程中的核心挑战。为此，我们提出OmniLayout，首个用于评估LLMs在真实几何、布线与连接约束下进行印刷电路板（PCB）布局放置推理的基准。OmniLayout包含1,681个工业级电路图耦合的PCB布局，涵盖四项任务：（1）芯片物理布局的几何推理，涉及77,240个受板边界约束的布局实例；（2）考虑可布线性的布局推理，生成物理可行的元件布局；（3）保持电路图定义的连通性与电子功能正确性；（4）通过调用外部工具实现任务（1）至（3）的代理式推理。实验结果表明，当前大模型在几何推理、布线优化及电气功能一致性方面存在显著局限。
原文摘要 · Abstract (English)
Recent large language models (LLMs) have demonstrated remarkable progress in 3D spatial reasoning, spatial grounding, and fine-grained geometric understanding. However, their ability to reason about densely packed object placement under strict spatial and functional constraints remains largely unexplored, despite being a fundamental challenge in practical electronic design automation (EDA) workflows. To bridge this gap, we introduce OmniLayout, the first benchmark designed to evaluate LLMs on printed-circuit-board (PCB) layout placement reasoning under real-world geometric, routing, and connectivity constraints. OmniLayout contains 1,681 industrial-grade schematic-coupled PCB layouts and includes four tasks: (1) geometric reasoning for IC physical placement, with 77.24K placement instances constrained within PCB board boundaries; (2) routability-aware placement reasoning, generating physically valid component placements; (3) electrical functionality, preserving schematic-specified connectivity and electronic functional correctness; and (4) tool-augmented agentic reasoning for invoking external tools to accomplish tasks (1)-(3). Our results reveal substantial limitations of current LLMs in PCB layout placement, including weak geometric reasoning, poor routability optimization, and inconsistent preservation of electrical functionality.
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