arXiv:2607.17401cs.CV2026-07

超分辨率可能掩盖缺陷,需以检测能力而非图像清晰度评估。

Does Super-Resolution Preserve Defect Evidence? A Low-False-Call Benchmark for Semiconductor Inspection

论文配图:Does Super-Resolution Preserve Defect Evidence? A Low-False-Call Benchmark for Semiconductor Inspection
图 1 · 摘自论文原文
  • 分离重建与检测流程,用统一残差检测器评估性能
  • 最佳重建模型漏检缺陷像素,远低于双三次插值
  • 强调检测任务证据保留,适合芯片质检研究者

超分辨率可使检测图像更清晰,但可能丢失缺陷判别证据。本文构建基准测试,分离重建与检测环节,在预设低误报率下评估两者表现。十次端到端实验结合独立生成的线/空间、接触孔图像,涵盖模型训练、校准、洁净样本、弱缺陷及预留缺陷形态。所有重建均使用同一局部残差检测器评分,另设直接与联合训练检测器对比。重建保真度与检测效用出现背离:两种学习型重建模型虽结构相似性最高,但在每次重复中检测到的缺陷像素均少于双三次插值。直接DeepLabV3检测器在0.000174±0.000084误报率下实现0.1984±0.0385召回率,且十次重复均满足预留可行性标准。联合模型DPU-WaferSR通过独立洁净校准,却在十次重复中均超出预留上限,说明校准成功不保证迁移性能。所有可行方法对弱缺陷的召回率始终接近零。将不变策略应用于4,591个公开Carinthia-S掩模后,进一步揭示真实SEM纹理下的显著方法依赖性偏差。结论明确:半导体检测中的超分辨率应以任务证据保留和工作点迁移能力为评判标准,而非仅看重建质量。

原文摘要 · Abstract (English)

Super-resolution can make inspection images appear sharper without preserving the evidence needed to detect a defect. We study this failure mode with a benchmark that separates reconstruction from detection and evaluates both at a predeclared low false-positive rate. Ten end-to-end repetitions combine independently generated line/space and contact-hole images with model training, calibration, clean controls, weak defects, and a held-out defect morphology. Every reconstruction is scored by the same local residual detector, while direct and jointly trained detectors form a separate comparison track. Reconstruction fidelity and inspection utility diverge: the two learned reconstruction models attain the highest structural similarity yet detect fewer defect pixels than bicubic interpolation in every paired repetition. A direct DeepLabV3 detector reaches $0.1984\pm0.0385$ recall at $0.000174\pm0.000084$ false-positive rate and satisfies the held-out feasibility criterion in all ten repetitions. An illustrative joint model, DPU-WaferSR, passes independent clean calibration but exceeds the held-out limit in all ten repetitions, demonstrating that calibration success does not guarantee transfer. Weak-defect recall remains near zero for every feasible method. Applying the unchanged policies to 4,591 public Carinthia-S masks further reveals large method-dependent shifts on real SEM texture. These results support a simple conclusion: super-resolution for inspection should be judged by preserved task evidence and operating-point transfer, not reconstruction quality alone.

缺陷检测超分辨率芯片质检图像重建

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