arXiv:2608.03738cs.AI2026-08

提出智能框架AgenticECO,自动修复3D集成电路布线缺陷,精度高且可追溯。

AgenticECO: An Agentic Framework for ECO on 3D Integrated Circuits

论文配图:AgenticECO: An Agentic Framework for ECO on 3D Integrated Circuits
图 1 · 摘自论文原文
  • 构建基于证据的智能代理流程,结合轻量修复层EcoRoute实现精准修复。
  • 在9个案例中成功修复7个,干扰率仅0.66%,零时钟网络被触碰。
  • 适合芯片设计自动化工程师,尤其关注可追溯性与低干扰修复的场景。

随着摩尔定律放缓,产业转向三维集成;然而在融合的3D-IC流程中,布线设计暴露了无二维类比的键级缺陷,且事后工程变更(ECO)仍依赖人工、经验驱动。标准的‘编辑后全重布线’做法使修复与路由器震荡纠缠,无法为修改行为赋予签核结果。本文提出AgenticECO——一个基于证据门控的工具使用智能体工作流,用于开源TaiWei流程中的3D-IC ECO;并引入EcoRoute,一种最小扰动的ECO布线层,通过不修改固定引脚的路由器,使修复可归因于具体编辑。在相同预算下对9个真实缺陷案例进行对比测试,AgenticECO成功修复7例,而全重布线和原生修复仅各修复2例,平均扰动率为0.66%,未触及任何时钟网络;在相同密封合约下的跨主干重跑也清除了全部9例缺陷。受控研究显示:修复移动是保持约束的必要条件,占用感知选择能获得合法落点而非单纯修复成功,且在更紧时序条件下,最小扰动可导致接受与拒绝的翻转。三项预注册视觉研究定位到像素仪器边缘对应争议落点,一项预注册盲诊断准确恢复所有隐藏注入缺陷,唯一实现零误改。所有通过结果均满足布线、提取、最大/最小延迟、DRC及结构等价门检查。代码、环境及每轮审计数据作为补充材料发布。

原文摘要 · Abstract (English)

As Moore's law slows, the industry is turning to three-dimensional integration; yet in merged 3D-IC flows, routed designs expose bond-level defects with no 2D analogue, and post-route engineering change orders (ECO) remain manual, expertise-bound work. Worse, the standard edit-then-fully-reroute practice entangles a repair with router churn, so a signoff number cannot be attributed to the edit that motivated it. We present AgenticECO, an evidence-gated tool-using agent workflow for 3D-IC ECO on the open-source TaiWei flow, paired with EcoRoute, a minimal-disturbance ECO-routing layer that drives the unmodified pinned router so a repair is attributable to its edit. Across nine matched natural defect cases under identical budgets, AgenticECO clears seven versus two for both full reroute and stock repair, at 0.66\% mean disturbance over cleared cases and zero clock nets touched, and a cross-backbone rerun under the same sealed contract clears all nine. Controlled studies show that the repair moves are necessary under preservation, that occupancy-aware choice buys legal landings rather than repair success, and that under tightened clocks minimal disturbance flips accept versus reject. Three preregistered visual studies localize the pixel instrument's edge to contested landing sites, and a preregistered blind diagnostic exactly restores every held-out injected defect, the only arm with zero wrong edits. Every accepted result passes routing, fresh extraction, max/min timing, DRC, and structural-equivalence gates. Code, environment, and per-episode audit artifacts are released as supplementary material.

3D IC智能修复EDA工具可追溯性

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