用累积热电特征提升碳化硅模块健康状态估计的跨失效机制泛化能力

Data-driven health-state estimators for SiC (Silica-Carbide) power modules typically report their performance on a single accelerated-aging campaign, and how that performance transfers to a different failure mechanism is rarely tested. We benchmark five reference methods from the prognostics and condition-monitoring literature against a physics-informed NODE (Neural Ordinary Differential Equation) on two SiC power-cycling campaigns driven by structurally different failure mechanisms, solder-layer fatigue and wire-bond lift-off, under a per-module $k$-fold protocol. The NODE is evaluated under two input regimes that share the rest of the pipeline: the baseline electrical precursors and a set of cumulative thermoelectric features. Every reference method degrades on the wire-bond campaign, with average errors growing and precision decreasing with respect to their performance on the soldered campaign. The NODE fed with the cumulative features keeps its soldered-campaign metrics on both mechanisms, with differences inside the fold-to-fold variance, while the same architecture fed with the baseline precursors falls back to the reference-method cluster. The input representation contributes at least as much as the architecture to failure-mechanism transferability of a health-state estimator.