Eco-SoC通过动态精度调节实现节能，1.1年就抵消碳足迹增量。

In an era defined by escalating climate change and the pervasive deployment of edge intelligence, the environmental cost of semiconductor manufacturing and operation has reached a critical threshold. As Deep Learning (DL) accelerators dominate System-on-Chip (SoC) die area, achieving true sustainability requires a paradigm shift from static worst-case efficiency to dynamic energy-proportionality. This paper introduces Eco-SoC, a highly scalable VLSI architecture co-designed specifically for sustainable artificial intelligence. We propose a hardware-level Dynamic Precision-Scaling Logic (DPSL) framework that adaptively modulates bit-width precision based on real-time activation sparsity, successfully reducing switching activity by up to 42% on a commercial 7nm FinFET process node. Furthermore, we transcend traditional Power-Performance-Area (PPA) metrics by providing a comprehensive Life Cycle Assessment (LCA) using the Architectural Carbon footprint Tool (ACT). Our synthesis demonstrates that Eco-SoC offsets its increased embodied carbon footprint (a marginal 4.8% area overhead) within 1.1 years of edge deployment. Finally, by introducing a thermal-aware power gating mechanism that mitigates localized hotspots, Eco-SoC doubles the projected Mean Time To Failure (MTTF) of the silicon, providing a tangible, scalable strategy for electronic waste (e-waste) mitigation in next-generation computing systems.